IPhone 6S 6SP Motherboard IC Chip Ball Soldering Net BGA Repair Stencil for Japan Steel Phone Logic Board

$9.99

In stock

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
IPhone 6S 6SP Motherboard IC Chip Ball Soldering Net BGA Repair Stencil for Japan Steel Phone Logic Board $9.99

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Product Name:
Unleash the potential of your iPhone 6s Plus or 6s with our BGA Reballing Stencil.

Features:
Efficiency at Its Best: Speedy alignment for reballing operations.
Ease of Use: Comes with positioning pins for exact alignment.
Durability: Designed for long service life and extended use.

Intended Use:
This tool is perfect for repairing or fixing issues with the iPhone 6s Plus and 6s processors.

Package Contents:
The package includes a single BGA Reballing Stencil crafted specifically for iPhone 6s and 6s Plus.

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