Precise details:Features:1. Using the new microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.2. Adopt infrared weld technology which independent exploration , infrared penetration strength , components uniform heating , beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.3. Technician focused infrared heat is easy to target most component removal/replacement and re-work.4. Infrared heat source bulbs are long-lived , un-expensive and easily replaced.5. Has bright delicate , low voltage LED lighting , safety and energy conservation.6.It has External Sensor Temperature control mode , that is detected by the sensor IC surface temperature control temperature , this function is good for freshman operation , it’s safe way protect components .7.MountTechnology (SMT) components 15-35cm in size.8. This machine has 540W heating system , widely to 120mm*120mm.9. Preheating plate color is black , from the photics point of view , black color easy to absorb heating , shorten the warm-up time.10. Powerful human function design , with the following functionsA. Temperature correction function Correction of temperature range -50°C~+50 °C ( Infrared lamp analog value 580 ).B. Celsius / Fahrenheit temperature display function11. This machine also has soldering iron function , if you have the device , you can used for all of the components solder , desoldering , preheating , repair all components , especially Micro BGA components.Specification:Voltage
AC220V±10%Max power
715WUser manual:Click here.Preheating station parts
Max power:540WLight-emitting components Far infrared heating plateTemperature Range
50°C-200°CDisplay Type
LEDPreheating area:120*120mmInfrared lamp part
Max power consumption
150WLight-emitting components Infrared emission lampTemperature Range
100°C-350°C / 212°F~662°FTemperature Stability:±1°CDisplay Type
LEDEffective irradiation area:35*35mmCome with 2 lens cup , you can be choice two of lens cup from 28mm / 38mm / 48mm.Soldering station part
Max power consumption
75WHeating components imported heaterTemperature Range:200°C-480°C / 392°F~896°FTemperature Stability
±1°C ( statics )Tip of ground voltage
Tip ground impedance
Display Type
LED DisplayHandle cable length:≥100cmOperation infrared BGA rework station NOTICE
1.Repair boards required precautions and necessary protective measures1)To ensure that both sides of the board preheat zone without fusible explosive flammable components , like Plastic , Display , Phone camera , LED , Electrolytic capacitors.2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area , If you can not avoid , Must use reflective paper keep out that. like Plastic , Display , Phone camera , LED , Electrolytic capacitors.2.According to IC size , use a suitable diameter lamp cup ( lamp cup size larger than IC size ) ; Install lights Cup minimize the distance between lamp and IC , to facilitates heating.3. Ensure that the working environment is no greater airflow to prevent heat loss , well sheltered measures when necessary.4. Apply solder paste to the IC before the desoldering , also you can early preheat then Apply solder paste , Especially BGA package IC , should be early preheat then apply solder paste , the can make solder paste penetrate into the bottom of the IC.5. Wear heat protective gloves and goggles. Place the visor , good shading measures to protect the eyes.6. Turn on the Infrared light power , set the temperature to about 280°C . Make the appropriate adjustments based on the size of the IC . IC by infrared light irradiation will be rapidly warming ( generally 1 to 3 minutes ) .7. Just started using this product , it is best to try to use the abandoned board rework a few times. and so familiar with the use of this product , then carry out normal maintenance work.540w IC Bga Rework Station , Infrared Soldering Station Repairing Boards Usage
1). Suitable for de-soldering and soldering BGA , SOIC , CHIP , QFP, PLCC package SMD IC,Particularly suitable for desoldering BGA module , computer motherboard north and south bridge,all kinds of mobile phone motherboard SMT IC and LED lights.2). Shrinking , Paint drying , adhesive removal , thawing, warming , Plastic welding etc.Package included:1 x Rework StationDetails Pictures:
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