Product Name:
Bid farewell to stubborn sealant glue and solder paste on your mobile phone motherboard with this Crescent Knife. Perfectly designed for A8, A9, A10, A11, and A12 CPU BGA chips, this handy tool is the ultimate solution to your disassembly and cleaning needs.
Description
Deploy it as a Crooked Knife for detailed disassembly, or use it as an effective Pry Tool for removing robust sealant glue from your mobile phone motherboard. It is also extremely effective as a UV Glue Cleaning Tool for those hard-to-reach corners. Calling it versatile would be an understatement – it easily removes sealant glue, acts as a reliable solder paste scraping knife for your cell phone BGA Repair, and is competent at cleaning UV glue!
Think of it as a Scimitar moon knife to your CPU NAND Baseband Edge glue removing operations. Removing mobile phone motherboard CPU NAND Baseband chip edge glue has never been easier.
Features:
- The body of this knife is thick, but sports a thin edge that is created from flexible material for pinpoint precision.
- The blade is flexible, offering the perfect balance between softness and hardness to take on the toughest of the glues.
- The knife handle features a skid-proof design offering an extremely comfortable grip.
Package Includes:
1 x Knife Handle
12 x UV Glue Removing Knife Blades
Feast your eyes on this expertly crafted tool down below:
