Immerse yourself in the brilliance of 3D laser square hole BGA reballing stencil template. Crafted with high-speed numerical control technology combined with high-temperature resistant toughened materials, this device ensures flawless precision in creating perfect round square holes. As a result, the durability of the steel net increases manifold, making it effortless to dislodge and improving productivity significantly.
Featuring a new patented Phone X Middle Layer Motherboard, this is the definitive tool for any Phone X Middle layer motherboard. It promises to assist professionals in executing Phone X BGA reballing in the most efficient and secure manner possible. This product is ideal for PHone 7/7p, PHone 6s/6sp and PHone 6/6p models.
Upon purchasing, you will receive a single BGA Reballing Tool packaged. Please note that images of the product provided are for illustrative purposes. You can view a detailed representation of the item from the links provided below:
