IPhone 6S Repair Stencil – Japan Steel BGA for Logic Board

$9.99

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Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
IPhone 6S Repair Stencil - Japan Steel BGA for Logic Board
$9.99

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Product Name:
Unleash the potential of your iPhone 6s Plus or 6s with our BGA Reballing Stencil.

Features:
Efficiency at Its Best: Speedy alignment for reballing operations.
Ease of Use: Comes with positioning pins for exact alignment.
Durability: Designed for long service life and extended use.

Intended Use:
This tool is perfect for repairing or fixing issues with the iPhone 6s Plus and 6s processors.

Package Contents:
The package includes a single BGA Reballing Stencil crafted specifically for iPhone 6s and 6s Plus.

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