Product Name: SP-X Middle Layer of BGA Motherboard Special Solder Paste
Get ready for a superior soldering experience with our SP-X Middle Layer of BGA Motherboard Special Solder Paste, renowned for its high density and high impedance properties. With a pure alloy composition, it ensures an enhanced level of connectivity. It’s fine and sticky texture allows it to adhere with ease while performing soldering work.
Stun with its flawless stannum plating, guaranteed to provide a seamless soldering experience without any bubbling. That’s not all, it also contains silver, adding a unique highlight to your work.
The product comes under the model number SP-X, and weighs just 50g, making it light and easy to handle. The compact size of 38 x 31 x 35mm allows it to be easily stored and transported.
The standout feature is its melting point of 158℃, enabling it to quickly and effectively establish connections.
Included in the package is 1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste.
Explore the extraordinary detailing of the product with the help of the images below. Don’t forget, an incredible soldering experience is just a click away!
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