Japanese Steel Phone Repair Stencil Tool for iPhone 7 Motherboard


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Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering Net
Japanese Steel Phone Repair Stencil Tool for iPhone 7 Motherboard $9.99

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Dive into the main features of this efficient reballing equipment intended to ease your iPhone 7 and 7P repair process. It offers rapid alignment for operation, ensuring that you aren’t spending unnecessary time fiddling about.

It’s also conveniently designed with positioning pins for precise alignment. No more guessing where things should go, it’s practically foolproof!

Another key feature is its durability. This tool promises a long operating and usage lifetime, making it a reliable part of your toolkit for a considerable period.

As mentioned, it’s particularly suited for the iPhone 7 and 7P models. So if you’re looking to repair or fix issues with these specific processor types, this tool is a must-have.

You’ll receive 1 x BGA Reballing Stencils for iPhone 7/7P in your package, ready to get to work as soon as it arrives.

Now, take a closer look at the detailed pictures below that give a better understanding of what to expect: