Qianli GTR100 3D BGA Reballing Stencil for iPhone Models, Hard Disk Logic Module Repair Tool

$9.99

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Qianli GTR100 3D BGA Reballing Stencil Hard Disk Logic Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P
Qianli GTR100 3D BGA Reballing Stencil for iPhone Models, Hard Disk Logic Module Repair Tool
$9.99

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Qianli GTR100 3D BGA Reballing Stencil Hard Disk Logic Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P
Qianli GTR100 3D BGA Reballing Stencil for iPhone Models, Hard Disk Logic Module Repair Tool
$9.99
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Immerse yourself in the brilliance of 3D laser square hole BGA reballing stencil template. Crafted with high-speed numerical control technology combined with high-temperature resistant toughened materials, this device ensures flawless precision in creating perfect round square holes. As a result, the durability of the steel net increases manifold, making it effortless to dislodge and improving productivity significantly.

Featuring a new patented Phone X Middle Layer Motherboard, this is the definitive tool for any Phone X Middle layer motherboard. It promises to assist professionals in executing Phone X BGA reballing in the most efficient and secure manner possible. This product is ideal for PHone 7/7p, PHone 6s/6sp and PHone 6/6p models.

Upon purchasing, you will receive a single BGA Reballing Tool packaged. Please note that images of the product provided are for illustrative purposes. You can view a detailed representation of the item from the links provided below:

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