Introducing an innovative tool enhancing precision and convenience in your work: Our 3D Laser Square Hole BGA Reballing Stencil Template. The combination of high-speed numerical control technology production and hardened heat resistant materials results in a tool that is incredibly sturdy and suitable for demanding work.
This tool is designed with a meticulous attention to detail such as round square precision holes, ensuring both longevity and ease of use. The adaptability and durability of the net make it that much easy and efficient to handle.
The tool extends its functionality with the new patented Phone X Middle Layer Motherboard. It’s designed exclusively for Phone X, creating a user-friendly platform for professional Phone X BGA reballing tasks. The combination of efficiency, convenience, and safety is a game-changer in your electronic repairs!
Included in the package is one essential BGA Reballing Tool.
Take a look at the detailed images of this groundbreaking tool below!
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