Repair Stencil for iPhone 8 and 8P Motherboard IC Chip Ball Soldering: Japan Steel Phone Logic Board BGA

$9.99

In stock

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering
Repair Stencil for iPhone 8 and 8P Motherboard IC Chip Ball Soldering: Japan Steel Phone Logic Board BGA $9.99

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Our specially crafted BGA Reballing Stencils for iPhone 8/8P brings efficiency and ease to the tedious task of reballing. Through quick alignment, our position pins ensure the precision necessary for the flawless functioning of your iPhone 8 or 8 Plus. This item is designed for a long-span operation and its durability guarantees its effectiveness over time.

No matter if you’re repairing or merely troubleshooting your iPhone 6s Plus or 6s processor, this tool is a must-have in your toolkit.

In every package, you’ll receive: 1 x BGA Reballing Stencils for iPhone 8/8P.

Take a look at our detailed images to get a closer look at the product.

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