Eliminate the hassle of removing the IP-X motherboard layering with our 185-degree layering process. Using the outstanding heating design and meticulous temperature control of the SS-T12A, we delicately heat only the sections necessary for removal. Meanwhile, the dual bayonet design allows the IP-X motherboard to rest stably on the stage. Furthermore, the use of high-purity copper as a negative film guarantees uniform and stable heat transfer and heating.
Presenting the T12A-Android, an extended member of the T12A family with an incorporated Android motherboard heating system. Its impeccable design and precise temperature control attribute provide a safe, and efficient maintenance experience. Good for the heating of most Android phone motherboards, this feature uses high-purity copper as the negative film to ensure consistency in heat transfer and heating.
Next up is the T12A-Face, a new addition that includes an ID heating station primarily used for the repairing of ID cables and risk-free replacement of distance sensors.
Meet T12A-X3 which adheres to our design of high and low grooves heating only the middle column but not the CPU. It has the capability to identify which parts need heating which makes this device essential for the heating disassembly of IP X / XS / XS MAX motherboard repair, CPU, and other components. The incorporation of silicone heat insulation ensures high-temperature resistance, reducing the temperature of the bottom contact surface.
The T12A-N11 belongs to the T12A mobile phone repair heating station series, specifically designed for the IP 11 series motherboard heating station. It provides fast and precise heating of the motherboard with a double buckle reinforcement ensuring safe and practical local heating.
This is an easy-to-use tool that gives an efficient layering of the motherboard. Compact, portable, and with an accurate positioning system, it is perfect for an IP 11/11 Pro /11 Pro Max.
This SUNSHINE product, created with undying dedication and continuous process improvement, comes with a variety of features such as IC slots, temperature control, quick heating, double buckle reinforcement, threaded interface, and silicone insulation.
Package Consists of: 1 x Host (A, B, C, D, E, F, G for your choices)
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